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Suspension board with circuit and producing method thereof

專利號
US10028378B2
公開日期
2018-07-17
申請人
NITTO DENKO CORPORATION（JP Osaka）
發(fā)明人
Hiroyuki Tanabe; Naohiro Terada; Yuu Sugimoto; Daisuke Yamauchi
IPC分類
H05K1/05; H05K1/11; H05K1/18; G11B5/48; H05K3/40; H05K3/44; H05K1/02; H05K1/03
技術(shù)領(lǐng)域
insulating,layer,terminal,base,side,region,board,portion,in,pedestal
地域： Osaka

摘要

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

說明書

The base portion-insulating layer 38 is formed corresponding to the conductor layer 10 in the base portion 21 of the mounting portion 18. The base portion-insulating layer 38 has a generally rectangular shape in plan view extending continuously from the board opening portion-insulating layer 34 toward both outer sides in the widthwise direction at the front side of the base portion 21 of the mounting portion 18. The base portion-insulating layer 38 is formed so as to extend forwardly with respect to the front end edge of the base portion 21. In the base portion-insulating layer 38, portions traversing the central portion 23 and exposed from the communicating spaces 24 in the mounting portion 18 are defined as one pair of rear piezoelectric-side terminal forming portions 43.

權(quán)利要求

1
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