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Suspension board with circuit and producing method thereof

專(zhuān)利號(hào)
US10028378B2
公開(kāi)日期
2018-07-17
申請(qǐng)人
NITTO DENKO CORPORATION（JP Osaka）
發(fā)明人
Hiroyuki Tanabe; Naohiro Terada; Yuu Sugimoto; Daisuke Yamauchi
IPC分類(lèi)
H05K1/05; H05K1/11; H05K1/18; G11B5/48; H05K3/40; H05K3/44; H05K1/02; H05K1/03
技術(shù)領(lǐng)域
insulating,layer,terminal,base,side,region,board,portion,in,pedestal
地域： Osaka

摘要

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

說(shuō)明書(shū)

The rear-side portion 58C is a rear-side portion with respect to the front end edge of the connecting terminal-opening portion 45 in the head-side terminal 58. The rear-side portion 58C bends downwardly continuously from the rear end portion of the central portion 58B to then extend rearwardly. In this manner, the upper surface of the rear-side portion 58C and the upper surface of the central portion 58B form a difference in level. The lower surface of the rear-side portion 58C is flush with the lower surface of the second base insulating layer 27 that is positioned at the inside of the stage opening portion 25. The rear-side portion 58C is disposed at the inside of the stage opening portion 25 and can be positioned further closer to the magnetic head 3.

權(quán)利要求

1
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