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Suspension board with circuit and producing method thereof

專利號(hào)
US10028378B2
公開日期
2018-07-17
申請(qǐng)人
NITTO DENKO CORPORATION(JP Osaka)
發(fā)明人
Hiroyuki Tanabe; Naohiro Terada; Yuu Sugimoto; Daisuke Yamauchi
IPC分類
H05K1/05; H05K1/11; H05K1/18; G11B5/48; H05K3/40; H05K3/44; H05K1/02; H05K1/03
技術(shù)領(lǐng)域
insulating,layer,terminal,base,side,region,board,portion,in,pedestal
地域: Osaka

摘要

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

說明書

A second pedestal 89 as one example of the pedestal is formed of the first rear-side base layer 30, the second rear-side base layer 51, and the rear-side slider contact layer 79. That is, the one pair of second pedestals 89 are provided. The one pair of second pedestals 89 are disposed at spaced intervals to each other in the front-rear direction. The one pair of second pedestals 89 are disposed at the rear side with respect to the one pair of first pedestals 88 and at generally the center in the widthwise direction of the one pair of first pedestals 88. In this manner, any one of the one pair of second pedestals 89, and the one pair of first pedestals 88 are disposed in a generally triangular shape with each of them as an apex.

The cover insulating layer 11 is formed of the same insulating material as that of the base insulating layer 9 (the first base insulating layer 26 and the second base insulating layer 27). The thickness of the cover insulating layer 11 with respect to 100% of the thickness of the first base insulating layer 26 is, for example, 50% or more, or preferably 80% or more and, for example, 200% or less, or preferably 150% or less. The thickness of the cover insulating layer 11 with respect to 100% of the thickness of the second base insulating layer 27 is, for example, 10% or more, or preferably 30% or more and, for example, 100% or less, or preferably 70% or less. To be specific, the cover insulating layer 11 has a thickness of, for example, 1 μm or more, or preferably 3 μm or more and, for example, 40 μm or less, or preferably 10 μm or less.

權(quán)利要求

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