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Suspension board with circuit and producing method thereof

專利號
US10028378B2
公開日期
2018-07-17
申請人
NITTO DENKO CORPORATION(JP Osaka)
發(fā)明人
Hiroyuki Tanabe; Naohiro Terada; Yuu Sugimoto; Daisuke Yamauchi
IPC分類
H05K1/05; H05K1/11; H05K1/18; G11B5/48; H05K3/40; H05K3/44; H05K1/02; H05K1/03
技術(shù)領(lǐng)域
insulating,layer,terminal,base,side,region,board,portion,in,pedestal
地域: Osaka

摘要

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

說明書

According to the suspension board with circuit 1, as shown in FIGS. 7A and 7B, the one pair of first front-side base layers 29 and the one pair of first rear-side base layers 30 are made of the first base insulating layer 26, the one pair of second front-side base layers 50 and the one pair of second rear-side base layers 51 are made of the second base insulating layer 27, and the one pair of front-side slider contact layers 78 and the one pair of rear-side slider contact layers 79 are made of the cover insulating layer 11, so that the one pair of first pedestals 88 and the one pair of second pedestals 89 can be formed by covering the wires 60 without separately providing a member so as to support the slider 4.

According to the method for producing the suspension board with circuit 1, as shown in FIGS. 7A and 7B, the suspension board with circuit 1 in which the thickness of the terminal region 62 is thicker than that of the circumferential region 63, and the head-side terminals 58 can be brought closer to the terminal of the slider 4 in the thickness direction can be produced.

Also, in the steps of forming the first terminal region-insulating layer 28 and the first circumferential region-insulating layer 95, the one pair of first front-side base layers 29 and the one pair of first rear-side base layers 30 can be simultaneously formed.

Thus, the pedestals can be efficiently formed without separately adding a step, while the head-side terminals 58 can be surely brought closer to the terminal of the slider 4.

<Modified Example>

權(quán)利要求

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