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Suspension board with circuit and producing method thereof

專利號
US10028378B2
公開日期
2018-07-17
申請人
NITTO DENKO CORPORATION(JP Osaka)
發(fā)明人
Hiroyuki Tanabe; Naohiro Terada; Yuu Sugimoto; Daisuke Yamauchi
IPC分類
H05K1/05; H05K1/11; H05K1/18; G11B5/48; H05K3/40; H05K3/44; H05K1/02; H05K1/03
技術(shù)領(lǐng)域
insulating,layer,terminal,base,side,region,board,portion,in,pedestal
地域: Osaka

摘要

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

說明書

Also, in the steps of forming the first terminal region-insulating layer and the first circumferential region-insulating layer, the first base pedestal layer can be simultaneously formed.

Thus, the pedestal can be efficiently formed without separately adding a step, while the connecting terminal can be surely brought closer to the terminal of the slider.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a plan view of a first embodiment of a suspension board with circuit of the present invention.

FIG. 2 shows a plan view of a gimbal portion of the suspension board with circuit shown in FIG. 1.

FIG. 3A shows a sectional view along an A-A line of the gimbal portion shown in FIG. 2.

FIG. 3B shows a sectional view along a B-B line of the gimbal portion shown in FIG. 2.

FIGS. 4A to 4C show process drawings for illustrating a method for producing the suspension board with circuit shown in FIG. 3B:

FIG. 4A illustrating a step of preparing a metal supporting board,

FIG. 4B illustrating a step of forming a first base insulating layer, and

FIG. 4C illustrating a step of forming a second base insulating layer.

權(quán)利要求

1
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