Manufacturing method of part-mounting package
地域：
Nagoya-shi, Aichi-ken
摘要
A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.
說明書
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This application claims priority to Japanese Patent Application No. 2014-008154, filed with the Japan Patent Office on Jan. 20, 2014, the entire content of which is hereby incorporated by reference.
Field of the Invention
The present disclosure relates to a manufacturing method of a part-mounting package.
Description of the Related Art
A part-mounting package includes, for example, a plate-like substrate base having a substrate front surface, a substrate rear surface, and substrate side surfaces. This substrate base has, for example, a multilayer structure including laminated multiple insulating layers and multiple conductor layers. Furthermore, this package may have end face through-hole conductors formed in the substrate side surfaces.
權利要求
What is claimed is:1. A method of manufacturing a plurality of part-mounting packages by a multi-cavity technique, wherein each of the plurality of part-mounting packages includes a substrate base shaped as a plate having a multilayered structure in which a plurality of insulating layers and a plurality of conductor layers are laminated, the substrate base including a substrate front surface, a substrate rear surface, and substrate side surfaces, at least one of the substrate side surfaces defining a side surface recess including a first recessed region, a second recessed region adjacent to the first recessed region in a thickness direction of the substrate base, and a step formed at a boundary between the first recessed region and the second recessed region, each of the plurality of part-mounting packages further including a part connection terminal on the substrate front surface to which an electronic part can be connected, an external connection terminal on the substrate rear surface, and an end face through-hole conductor covering the second recessed region and avoiding the first recessed region,the method comprising: a sheet preparation process of preparing a plurality of multi-cavity insulating sheets, including a first insulating sheet and a second insulating sheet, of an insulating material; a through-hole forming process of forming a first through-hole in the first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in the second insulating sheet; a conductor forming process of forming a penetration conductor covering an inner surface of the second through-hole without covering an inner surface of the first through-hole, forming a first conductor layer on a surface of the second insulating sheet, forming a second conductor layer on a surface of the first insulating sheet, forming an unfired conductor layer that is to be the part connection terminal, and forming an unfired conductor layer that is to be a wiring metalized conductor layer for electrically connecting the part connection terminal and the end face through-hole conductor; a sheet lamination process of laminating the first insulating sheet on the second insulating sheet such that the first through-hole is aligned with the second through-hole to form a sheet laminated body; a ceramic firing process of firing the sheet laminated body obtained after the sheet lamination process to obtain a ceramic fired material; after the ceramic firing process, supplying a current to the penetration conductor that is to be the end face through-hole conductor and to the part connection terminal via the wiring metalized conductor layer, and electroplating a plating layer on the part connection terminal; a division groove forming process of laser machining the sheet laminated body to form two linear laser division grooves that intersect at substantially a center of the first through-hole; and a dividing process of dividing the sheet laminated body along the laser division grooves for separating the sheet laminated body into the plurality of part-mounting packages and exposing a separation surface of each of the plurality of part-mounting packages; wherein the separation surface exposed by the dividing process is the at least one substrate side surface defining the side surface recess, a portion of the inner surface of the first through-hole exposed by the dividing process is the first recessed region of the side surface recess, and a portion of the penetration conductor exposed by the dividing process is the end face through-hole conductor of each of the plurality of part-mounting packages which avoids the first recessed region; wherein the division groove forming process is performed after the sheet lamination process and before the ceramic firing process; wherein, in the conductor forming process, the penetration conductor is an unfired penetration conductor and the first conductor layer and the second conductor layer are unfired conductor layers that are to be metalized conductor layers; and wherein, in the sheet preparation process, the first insulating sheet is a first unfired ceramic sheet and the second insulating sheet is a second unfired ceramic sheet. 2. The method of claim 1 ,wherein, in the division groove forming process of laser machining the sheet on the second insulating sheet, the two linear laser division grooves intersect with the center of the first through-hole and intersect with a center of the second through-hole. 3. A method of manufacturing a plurality of part-mounting packages by a multi-cavity technique, wherein each of the plurality of part-mounting packages includes a substrate base shaped as a plate having a multilayered structure in which a plurality of insulating layers and a plurality of conductor layers are laminated, the substrate base including a substrate front surface, a substrate rear surface, and substrate side surfaces, at least one of the substrate side surfaces defining a side surface recess including a first recessed region, a second recessed region adjacent to the first recessed region in a thickness direction of the substrate base, and a step formed at a boundary between the first recessed region and the second recessed region, each of the plurality of part-mounting packages further including a part connection terminal on the substrate front surface to which an electronic part can be connected, an external connection terminal on the substrate rear surface, and an end face through-hole conductor covering the second recessed region and avoiding the first recessed region,the method comprising: a sheet preparation process of preparing a plurality of multi-cavity insulating sheets, including a first insulating sheet and a second insulating sheet, of an insulating material; a through-hole forming process of forming a first through-hole in the first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in the second insulating sheet; a conductor forming process of forming a penetration conductor covering an inner surface of the second through-hole without covering an inner surface of the first through-hole, forming a first conductor layer on a surface of the second insulating sheet, forming a second conductor layer on a surface of the first insulating sheet, forming an unfired conductor layer that is to be the part connection terminal, and forming an unfired conductor layer that is to be a wiring metalized conductor layer for electrically connecting the part connection terminal and the end face through-hole conductor; a sheet lamination process of laminating the first insulating sheet on the second insulating sheet such that the first through-hole is aligned with the second through-hole to form a sheet laminated body; a ceramic firing process of firing the sheet laminated body obtained after the sheet lamination process to obtain a ceramic fired material; after the ceramic firing process, supplying a current to the penetration conductor that is to be the end face through-hole conductor and to the part connection terminal via the wiring metalized conductor layer, and electroplating a plating layer on the part connection terminal; a division groove forming process of laser machining the sheet laminated body to form two linear laser division grooves that intersect at substantially a center of the first through-hole; and a dividing process of dividing the sheet laminated body along the laser division grooves for separating the sheet laminated body into the plurality of part-mounting packages and exposing a separation surface of each of the plurality of part-mounting packages; wherein the separation surface exposed by the dividing process is the at least one substrate side surface defining the side surface recess, a portion of the inner surface of the first through-hole exposed by the dividing process is the first recessed region of the side surface recess, and a portion of the penetration conductor exposed by the dividing process is the end face through-hole conductor of each of the plurality of part-mounting packages which avoids the first recessed region; wherein the division groove forming process is performed after the ceramic firing process; wherein, in the conductor forming process, the penetration conductor is an unfired penetration conductor and the first conductor layer and the second conductor layer are unfired conductor layers that are to be metalized conductor layers; and wherein, in the sheet preparation process, the first insulating sheet is a first unfired ceramic sheet and the second insulating sheet is a second unfired ceramic sheet. 4. The method of claim 3 ,wherein, in the division groove forming process of laser machining the sheet on the second insulating sheet, the two linear laser division grooves intersect with the center of the first through-hole and intersect with a center of the second through-hole.
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