As illustrated in FIG. 1 and FIG. 2, a ceramic package 10 manufactured by the method according to the present embodiment is a part-mounting package for mounting a quartz oscillator 11 therein as an electronic part. This ceramic package 10 is a rectangle flat plate-like member, and its size is, for example, length 0.8 mm×width 1.2 mm×height 0.5 mm. In more detail, the ceramic package 10 manufactured according to the present embodiment has a rectangle plate-like substrate base 20. Further, the substrate base 20 has a substrate front surface 12, a substrate rear surface 13, and substrate side surfaces 14. The substrate base 20 has multilayer structure including a plurality of ceramic insulating layers 15 and 16 made of a ceramic material and a plurality of conductor layers 18 and 19 formed of metalized conductor layers. Each of the ceramic insulating layers 15 and 16 is made of an alumina sintered material. The conductor layers 18 and 19 have layers containing tungsten, molybdenum, or an alloy thereof, for example. It is noted that the ceramic package 10 of the present embodiment has the structure including two laminated ceramic insulating layers. However, multilayer structure including three or more laminated ceramic insulating layers may be employed.