In the surface of the ceramic insulating layer 15 in the upper layer side in the substrate base 20, a sealing conductor layer 19 is formed. The sealing conductor layer 19 is provided in the outer periphery of the cavity 34 so as to surround that cavity 34. That is, the sealing conductor layer 19 is formed on the upper end face of a wall part 37 (a frame) formed around the cavity 34. The wall part 37 of the cavity 34 is formed by the ceramic insulating layer 15 in the upper layer side. A lid member 38 for sealing the cavity 34 is joined to the sealing conductor layer 19 by a welding such as a brazing.

In the ceramic package 10, the ceramic insulating layer 15 in a predetermined corner of the substrate base 20 (the right-upper corner in FIG. 2) is formed with a through-hole 40 penetrating it in its thickness direction. Inside the through-hole 40, a through-hole conductor 41 connected to the sealing conductor layer 19 is formed. In the ceramic package 10 manufactured by the method according to the present embodiment, the first recessed region 26 and the second recessed region 27 of the side surface recess part 25 are arranged closer to the outer periphery of the substrate than the forming position of the through-hole conductor 41 in the corner of the substrate base 20.

Next, a manufacturing method of the ceramic package 10 according to the present embodiment will be described.