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Manufacturing method of part-mounting package

專利號
US10034383B2
公開日期
2018-07-24
申請人
NGK SPARK PLUG CO., LTD.（JP Nagoya）
發(fā)明人
Kazushige Akita
IPC分類
H05K3/00; H05K3/46; H05K3/10; H05K3/40; H05K1/11; H05K1/18
技術(shù)領(lǐng)域
conductor,ceramic,recessed,hole,package,in,sheet,unfired,substrate,layer
地域： Nagoya-shi, Aichi-ken

摘要

A method of manufacturing a part-mounting package includes: forming a first through-hole in a first insulating sheet and forming a second through-hole whose opening area is larger than the first through-hole in a second insulating sheet; forming a penetration conductor covering an inner surface of the second through-hole and forming a conductor layer on a surface of at least the second insulating sheet; laminating the first insulating sheet and the second insulating sheet where center positions of the first through-hole and the second through-hole are matched to each other; causing linear laser division grooves to pass through a center of the first through-hole and the second through-hole; and dividing the sheet laminated body along the laser division grooves, and causing the side surface recess part and the end face through-hole conductor to appear.

說明書

In the ceramic firing process after the division groove forming process, the ceramic green sheet laminated body 62 is heated at a predetermined temperature (for example, a temperature around 1500 degrees centigrade to 1800 degrees centigrade) at which alumina can be sintered. Each of the ceramic green sheets 51 and 52 of the ceramic green sheet laminated body 62 is sintered through this firing, so that a large size ceramic package 71 (a ceramic fired body that is a fired sheet laminated body) is obtained (see FIG. 14). Further, as illustrated in FIG. 14, metalized conductor layers 72 to 77 such as the part connection terminals 21, the external connection terminals 22, the conductor layer 18 of the internal layer, the end face through-hole conductors 30, the through-hole conductor 41, and the sealing conductor layer 19 are formed by the sintering of the conductive paste. It is noted that the ceramic package 71 obtained here is a multi-cavity package having the structure including a plurality of product regions R1 as the ceramic packages 10 aligned vertically and horizontally on a flat face.

權(quán)利要求

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