In the above-described embodiments, specific description has been made for the manufacturing method of the ceramic packages 10 and 10A to 10C having the ceramic substrate bases 20 and 20A to 20C including the laminated multiple ceramic insulating layers 15 to 17 and the laminated multiple conductor layers 18 and 19. However, the present manufacturing method is not limited to the above. The present manufacturing method may be applied to the manufacturing of an organic package having a resin substrate base including laminated multiple resin insulating layers and laminated multiple conductor layers.

Next, besides the technical concept described in the claims (the present manufacturing method), the technical concepts understood from the above-described embodiments will be listed below.

(1) The manufacturing method of the part-mounting package in the present manufacturing method, wherein, in the division groove forming process, the laser division groove is formed such that two laser division grooves intersect at the center of each of the through-holes.

(2) The manufacturing method of the part-mounting package in the present manufacturing method, wherein the substrate base is shaped in a rectangle plate and the end face through-hole conductors are formed in four corners in the substrate base.

(3) The manufacturing method of the part-mounting package in the present manufacturing method, wherein the substrate base is shaped in a rectangle plate, and the end face through-hole conductors are formed in edges connecting corners in the substrate base.