Manufacturing method of part-mounting package
摘要
說明書
(15) The part-mounting package in any one of the technical concepts (8) to (13), wherein a length of the second recessed region in a thickness direction of the substrate base is longer than a length of the first recessed region in the same direction.
(16) The part-mounting package in any one of the technical concepts (8) to (15), wherein the electronic part is a quartz device.
The foregoing detailed description has been presented for the purposes of illustration and description. Many modifications and variations are possible in light of the above teaching. It is not intended to be exhaustive or to limit the subject matter described herein to the precise form disclosed. Although the subject matter has been described in language specific to structural features and/or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims appended hereto.
