Rather, as in case (4) above for example, if the reception of bulk components and the reception of tape components for which the mounting position is close to the bulk component mounting position are performed together, an effect of improving the efficiency of the mounting operation is obtained.

Also, although in the above embodiment the component supply section 96 of the multiple bulk feeders 90 is selectively moved to a common tape component receiving position by the multiple bulk feeders 90 being moved by feeder moving device 98, an embodiment may be such that, for example, as disclosed in JP-A-2011-206452, each component supply position of the multiple bulk feeders is fixed on the head main body to correspond to each of the multiple revolving positions of the suction nozzles 80.

Also, although in the above embodiment the mounting head provided with multiple suction nozzles 80 includes a rotation holding body 68, other embodiments may be applied to, for example, an electronic circuit component mounter provided with a non-rotating type mounting head such as a mounting head in which multiple suction nozzles are held in a line, and with which reception and mounting of components is performed by suction nozzles selected from those suction nozzles, or an electronic circuit component mounting system including such an electronic circuit component mounter, or an electronic circuit component mounting method using that mounter or mounting system.