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Cooling system for data center

專利號(hào)
US10070561B1
公開日期
2018-09-04
申請(qǐng)人
Amazon Technologies, Inc.(US NV Reno)
發(fā)明人
John William Eichelberg; Brock Robert Gardner; Alan Donald Gillooly
IPC分類
F25D23/12; H05K7/20
技術(shù)領(lǐng)域
liquid,air,aisles,cold,can,rack,least,at,surface,computing
地域: NV NV Reno

摘要

A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

說明書

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No. 14/100,413 filed on Dec. 9, 2013, the entire contents are incorporated herein by reference.

BACKGROUND

Computing-intensive or data-intensive organizations such as on-line retailers, Internet service providers, search providers, financial institutions, and the like often conduct computer operations from large scale computing facilities, known as data centers. Such computing facilities house and accommodate a large number of server, network, and other computer equipment suitable to process, store, and exchange data as desired to facilitate the organization's operations. Data centers can be located local to the organization or remote from the organization, such that data can be exchanged to and from the data center over a hard wire, over the internet, or a combination of the two. Typically, a computer room of a data center includes many racks that each includes a rack housing that supports a plurality of brackets that are spaced from one another so as to define a corresponding plurality of mounting slots, otherwise known as bays. The racks are configured to support a respective plurality of servers that are rack-mounted to the rack housing in the bays so as to define a rack system.

權(quán)利要求

1
What is claimed:1. A building comprising:a building structure that defines an internal environment;a cooling system including at least one surface that is wetted with a liquid and in fluid communication with the internal environment, and an air mover configured to direct source air over the liquid substantially parallel to the at least one surface so as to produce cold air that flows from the at least one surface to the internal environment,wherein the cold air passes through the internal environment, such that the internal environment transfers heat to the cold air so as to produce hot air, and the hot air is exhausted out the internal environment.2. The building of claim 1, further comprising a liquid delivery system that includes at least one liquid delivery member that is maintained at a temperature below a dew point of surrounding air so as to generate condensation that is disposed on the at least one surface to define the liquid.3. The building of claim 2, wherein the at least one surface is defined by a porous material, and wherein at least a portion of the at least one liquid delivery member is embedded in the porous material and configured to deliver liquid that travels through the porous material to the at least one surface.4. The building of claim 2, wherein the at least one liquid delivery member is configured to spray liquid onto the at least one surface.5. The building of claim 2, wherein the at least one liquid delivery member is supported above the at least one surface such that liquid travels to the at least one surface under gravitational forces.6. The building of claim 1, further comprising a first row of rack systems supported at a first level of the building, wherein the first row of rack systems is disposed between a first hot air aisle and a first cold air aisle, and the first row of rack systems comprises at least one rack housing and a first plurality of computing devices supported by the at least one rack housing of the first row of rack systems.7. The building of claim 6, further comprising a second row of rack systems supported at a second level of the building that is disposed above the first level of the building, wherein the second row of rack systems is disposed between a second hot air aisle and a second cold air aisle, the second row of rack systems comprises at least one rack housing and a second plurality of computing devices supported by the at least one rack housing of the second row of rack systems.8. The building of claim 7, wherein the cold air travels from the at least one surface to the second cold air aisle, such that the computing devices of the second plurality of computing devices receive the cold air from the second cold air aisle and transfer heat to the received cold air so as to produce hot air that is exhausted into the second hot air aisle.9. The building of claim 8, wherein the first and second cold air aisles are arranged such that a portion of the cold air travels from the at least one surface to the first cold air aisle and into the computing devices of the first plurality of the computing devices, and another portion of the cold air travels through the first cold air aisle to the second cold air aisle, and into the computing devices of the second plurality of computing devices.10. The building of claim 9, wherein the first and second cold air aisles are inline with each other so as to define a cold air column that is open to the at least one surface and extends through the first level to the second level of the building.11. The building of claim 7, wherein the first and second hot air aisles are inline with each other so as to define a hot air column that extends out the building into an ambient environment, such that the hot air that is exhausted by the first plurality of computing devices travels from the first hot air aisle to the second hot air aisle and is expelled out the internal environment.12. The building of claim 1, further comprising a plurality of rows of rack systems, wherein the plurality of rows of rack systems are spaced from each other such that each of the plurality of rows of rack systems is disposed between a respective one of a plurality of hot air aisles and a respective one of a plurality of cold air aisles, wherein at least some of the rack systems of the plurality of rows of rack systems comprises a respective rack housing and computing devices supported by the rack housing.13. The building of claim 12, further comprising a liquid distribution member that defines a plurality of conduits in fluid communication with a corresponding one of the plurality of cold air aisles.14. The building of claim 13, further comprising a porous floor disposed between the plurality of cold air aisles and the plurality of conduits, wherein the cold air flows from the plurality of conduits, through the porous floor, and into the plurality of cold air aisles.15. The building of claim 13, wherein the plurality of conduits are at least partially defined by respective surfaces that are wetted with a liquid, and the plurality of conduits are aligned with at least respective ones of a plurality of cold air aisles that are configured to deliver cold air to respective pluralities of computing devices.16. A method for removing heat from computing devices, comprising:introducing a liquid onto at least one surface;directing source air to flow over the liquid substantially parallel to the at least one surface so as to produce cold air that flows towards the computing devices; andwherein the cold air passes through the computing devices such that the computing devices transfer heat to the cold air so as to produce hot air, and the hot air is exhausted out the computing devices.17. The method of claim 16, comprising:maintaining at least one liquid delivery member at a temperature below a dew point of surrounding air so as to generate condensation that is disposed on the at least one surface to define the liquid.18. A system for removing heat from computing devices, comprising:at least one surface that is wetted with a liquid;an air mover configured to direct source air to flow over the liquid substantially parallel to the at least one surface so as to produce cold air that flows towards the computing devices;wherein the cold air passes through the computing devices such that the computing devices transfer heat to the cold air so as to produce hot air, and the hot air is exhausted out the computing devices.19. The system of 18, further comprising at least one liquid delivery member that is maintained at a temperature below a dew point of surrounding air so as to generate condensation that is disposed on the at least one surface to define the liquid.20. The system of 19, wherein the at least one surface is defined by a porous material, and wherein at least a portion of the at least one liquid delivery member is embedded in the porous material and configured to deliver liquid that travels through the porous material to the at least one surface.
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