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Cooling system for data center

專利號
US10070561B1
公開日期
2018-09-04
申請人
Amazon Technologies, Inc.(US NV Reno)
發(fā)明人
John William Eichelberg; Brock Robert Gardner; Alan Donald Gillooly
IPC分類
F25D23/12; H05K7/20
技術(shù)領(lǐng)域
liquid,air,aisles,cold,can,rack,least,at,surface,computing
地域: NV NV Reno

摘要

A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

說明書

Alternatively, referring to FIG. 6B, the frame 70 can include a single material 84 that defines both the first at least one surface 74 and the second at least one surface 76. The single material 84 can be substantially impermeable with respect to the liquid, and in particular water. In accordance with one embodiment, the single material 84 is concrete, though it is envisioned that the first and second materials 80 and 82 and the single material 84 can be made of any suitable alternative material as desired. As illustrated in FIG. 6B, the liquid delivery member 58 can be suspended above the at least one surface 54 as described above with respect to FIG. 6A. It should be appreciated that the liquid distribution system 52 can include any number of liquid delivery members 58 as desired. For instance, as illustrated in FIG. 6C, the liquid distribution system 52 can include a first liquid delivery member 58 adjacent to a first one of the sides 54b, and a second liquid delivery member 58 adjacent to a second one of the sides 54b.

權(quán)利要求

1
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