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Cooling system for data center

專利號
US10070561B1
公開日期
2018-09-04
申請人
Amazon Technologies, Inc.(US NV Reno)
發(fā)明人
John William Eichelberg; Brock Robert Gardner; Alan Donald Gillooly
IPC分類
F25D23/12; H05K7/20
技術(shù)領(lǐng)域
liquid,air,aisles,cold,can,rack,least,at,surface,computing
地域: NV NV Reno

摘要

A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.

說明書

For instance, the first and second cold air aisles 33a and 33b can be arranged such that a portion of the cold air 61 travels from the at least one surface 54 to the first cold air aisle 33a and into the computing devices 34 of the first plurality of the computing devices 34a, and another portion of the cold air 61 travels through the first cold air aisle 33a to the second cold air aisle 33b, and into the computing devices 34 of the second plurality of computing devices 34b. For instance, the first and second cold air aisles 33a and 33b can be inline with each other so as to define a cold air column 33c that is open to the at least one surface 54 and extends through the first level 20a to the second level 20b of the data center 20. Similarly, the first and second hot air aisles 32a and 32b can be inline with each other so as to define a hot air column 32c that extends through the first level 20a to the second level 20b of the data center 20, and out the data center 20 into the ambient environment 66, such that the hot air 63 exhausted by the first plurality of computing devices 34a travels from the first hot air aisle 32a to the second hot air aisle 32b through the hot air column 32c and is expelled out the data center 20. Alternatively, the first and second cold air aisles 33a and 33b can be offset from each other, such that cold air such that a portion of the cold air 61 travels from the at least one surface 54 to the first cold air aisle 33a and into the computing devices 34 of the first plurality of computing devices 34a, and another portion of the cold air 61 can be routed laterally from the first cold air aisle and through a second cold air aisle 33b that is not aligned with the first cold air aisle 33a along the vertical direction, and subsequently drawn through the respective computing devices 34 of the second row 27b. Similarly, the first and second hot air aisles 32a and 32b can be offset from each other. The hot air column 32c, or the second hot air aisles 32b, can define the chimneys 44 that extend out from the roof 46 of the data center 20.

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