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Integrated high side gate driver structure and circuit for driving high side power transistors

專利號
US10096705B2
公開日期
2018-10-09
申請人
Infineon Technologies Austria AG(AT Villach)
發(fā)明人
Allan Nogueras Nielsen; Mikkel H?yerby
IPC分類
H03F3/217; H01L29/78; H01L21/8238; H01L21/761; H01L27/06; H03K17/687
技術(shù)領(lǐng)域
driver,voltage,gate,transistor,diffusion,dc,high,ldnmos,class,supply
地域: Villach

摘要

An integrated high side gate driver structure for driving a power transistor. The structure includes a semiconductor substrate having a first polarity semiconductor material in which a first well diffusion including a second polarity semiconductor material is formed. An outer wall of the first well diffusion is abutted to the substrate. A second well diffusion, having first polarity semiconductor material, is arranged inside the first well diffusion such that an outer wall of the second well diffusion abuts an inner wall of the first well diffusion. The structure includes a gate driver having high side positive and negative supply voltage ports, and a driver input and output. The gate driver includes a transistor driver in the second well diffusion such that control and output terminals of the transistor driver are coupled to the driver input and output, respectively. The structure also includes respective electrical connections between the first and second well diffusions and the negative supply voltage port.

說明書

The novel well structure 424 which encloses or houses the gate driver 411 is of similar construction as the previously discussed well-structure 324 and corresponding features have been provided with corresponding reference numerals to ease comparison. The gate driver 411 comprises an inverter comprising cascaded PMOS-NMOS transistor pair 401, 403 with a driver output 404 electrically coupled or connected to a gate terminal of the LDNMOS power transistor 407 on a high side of the class D output stage. Drain, gate and source diffusions or terminals of the NMOS transistor 403 of the gate driver 411 are arranged in a vertical wall section 429 of P+ polarity semiconductor material as illustrated on FIG. 4B. This vertical wall section 429 is a part of an inner P-well diffusion of the novel well structure 424. The novel well structure 424 additionally comprises an N+ polarity transistor body diffusion 435 arranged in abutment to the opposing wall segments of the vertical wall section 429 and above the horizontal P+ buried layer 427. Drain, gate and source diffusions or terminals of the PMOS transistor 401 of the gate driver 411 are arranged in the N+ polarity transistor body diffusion 435 as illustrated on FIG. 4B). The gate terminals of the PMOS-NMOS transistor pair 401, 403 are electrically connected via a wire or trace 404 to form an input 414 of the gate driver. The PMOS source terminal and the NMOS drain terminal of invertor or transistor pair 401, 403 are electrically connected via a wire or trace 415 to form the output node or terminal 425 of the gate driver 411. The latter output node 425 is connected to the gate of the high side power LDNMOS transistor 407 of the class D output stage. The electrical wire or trace pattern 412a establishes electrical connection between the source of the NMOS driver transistor 403 and the inner P-well diffusion via the indicated black rectangular well contact. The electrical wire or trace pattern 412a likewise establishes electrical connection between the source of the NMOS driver transistor 403 and the outer N-well diffusion 430 via the well contact (illustrated by white rectangle symbol) embedded in the diffusion 430. The electrical wire or trace pattern 412a accordingly connects the high side negative supply voltage port of the gate driver 411 to the inner P-well diffusion, the outer N-well diffusion and to the output terminal OUT 412 of the class D output stage. The other electrical connection, wire or trace 412b establishes a further electrical connection between the inner P-well diffusion and the outer N-well diffusion via respective well contacts. The coupling of the parasitic well capacitance 413 (NBL-epi Cap) to the P type epitaxial semiconductor substrate 422 is schematically illustrated by the capacitor symbol 413 on FIG. 4A) and FIG. 4B) which illustrate how the parasitic well capacitance 413 has been eliminated from the regulated DC voltage node 406, GVDD_FLOAT. The parasitic well capacitance 413 has been moved and connected to the low impedance output terminal OUT 412 of the class D output stage leading to the previously discussed benefits.

權(quán)利要求

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