More specifically, the insulating layer 102 is provided over the substrate 101, and the insulating layer 103 is provided over the insulating layer 102. The insulating layer 106 is provided over the insulating layer 103, and the wiring 118_1 is provided in the same layer as the insulating layer 106. In this embodiment, an example in which the wiring 118_1 is a stacked layer of a wiring 118_1a and a wiring 118_1b is described. The insulating layer 107 is provided over the insulating layer 106 and the wiring 118_1, and the insulating layer 104 is provided over the insulating layer 107. The electrode 105_1 is provided in the same layer as the insulating layers 107 and 104.
The insulating layer 108 is provided over the electrode 105_1 and the insulating layer 104. The insulating layer 108 has a projection, the semiconductor layer 109_1a is provided over the projection, and the semiconductor layer 109_1b is provided over the semiconductor layer 109_1a.