Here, the details of the deposition chamber (sputtering chamber) are described with reference to FIG. 62B and FIGS. 63A to 63C. FIG. 63A illustrates the inside of the deposition chamber 2706b. The deposition chamber 2706b includes a target 2766a, a target 2766b, a target shield 2767a, a target shield 2767b, a magnet unit 2790a, a magnet unit 2790b, a substrate holder 2768, a power source 2791a, and a power source 2791b. The target 2766a is provided on a backing plate 2789a (not illustrated in FIG. 62B). The target 2766b is provided on a backing plate 2789b (not illustrated in FIG. 62B). The power source 2791a is electrically connected to the target 2766a, and the power source 2791b is electrically connected to the target 2766b. The magnet unit 2790a is provided on a back side of the target 2766a with the backing plate 2789a positioned therebetween. The magnet unit 2790b is provided on a back side of the target 2766b with the backing plate 2789b positioned therebetween. The target shield 2767a is provided so as to surround an end portion of the target 2766a and the target shield 2767b is provided so as to surround an end portion of target 2766b.
