The insulating layer 111_1 is provided over the semiconductor layer 109_1c, and the electrode 112_1 is provided over the insulating layer 111_1. The insulating layer 111_1 and the electrode 112_1 include a region overlapping with the region 189c. In this embodiment, an example in which the electrode 112_1 is a stacked layer of an electrode 112_1a and an electrode 112_1b is described.
The transistor 100 further includes the insulating layer 113_1 over the electrode 112_1. The electrode 112_1 is covered with the insulating layer 113_1. The insulating layers 111_1 and 113_1 extend beyond an end portion of the electrode 112_1, and have a region where the insulating layers 111_1 and 113_1 are in contact with each other in the extended portion.
In this embodiment, an insulating layer 114 is provided to cover the transistor 100, and an insulating layer 115 is provided over the insulating layer 114.