With the above deposition apparatus, entry of impurities into the oxide semiconductor can be suppressed. Furthermore, when a film in contact with the oxide semiconductor is formed with the use of the above deposition apparatus, the entry of impurities into the oxide semiconductor from the film in contact therewith can be suppressed.
This embodiment can be implemented in an appropriate combination with any of the structures described in the other embodiments and the like.
This application is based on Japanese Patent Application serial no. 2016-061869 filed with Japan Patent Office on Mar. 25, 2016, the entire contents of which are hereby incorporated by reference.