What is claimed:1. A method of forming colloidal nanocrystal (NC)-based thin film devices, the method comprising the steps of:depositing a dispersion of NCs on a substrate to form a NC thin-film, wherein at least a portion of the NCs is capped with chalcogenocyanate (xCN)-based ligands; anddoping the NC thin-film with a metal.2. The method of claim 1, wherein the doping step comprises evaporation and thermal diffusion.3. The method of claim 1, wherein the metal is at least one of indium-based, lead-based, tin-based, gallium-based or selenium-based.4. The method of claim 1, wherein the doping step occurs at about room temperature.5. The method of claim 1, wherein the doping step is initiated by annealing.6. The method of claim 1, wherein the doping step comprises blanket deposition.7. The method of claim 1, wherein the NCs are at least one of cadmium-based, lead-based, zinc-based, or bismuth-based.8. The method of claim 1, wherein the substrate is flexible.9. The method of claim 1, wherein the metal is patterned on the NC thin film device.10. The method of claim 1, further comprising depositing one or more additional layer of NCs on the previously deposited layer of NCs.11. A method of forming colloidal nanocrystal (NC)-based thin film devices, the method comprising the step of:depositing a dispersion of NCs on a substrate to form a NC thin-film, wherein at least a portion of the NCs is capped with chalcogenocyanate (xCN)-based ligands.12. The method of claim 11, wherein the NCs are at least one of cadmium-based, lead-based, zinc-based, or bismuth-based.13. The method of claim 11, wherein the substrate is flexible.14. A method of forming colloidal nanocrystal (NC)-based thin film devices, the method comprising the steps of:depositing a dispersion of NCs on a substrate; anddoping the NC thin film with a metal by evaporation and thermal diffusion to form a NC-based thin film device.15. The method of claim 14, wherein at least a portion of the NCs is capped with chalcogenocyanate (xCN)-based ligands.16. The method of claim 14, wherein the doping step comprises annealing the NC thin film with a metal, thereby diffusing a portion of the metal into the NC thin film.17. The method of claim 14, wherein the metal is at least one of indium-based, lead-based, or selenium-based.18. The method of claim 14, wherein the deposited NC thin-film is doped at about room temperature.19. The method of claim 14, wherein the deposited NC thin film is doped by annealing.20. The method of claim 14, wherein the NCs are at least one of cadmium-based, lead-based, zinc-based, or bismuth-based.21. The method of claim 14, wherein the substrate is flexible.22. The method of claim 14, wherein the metal is patterned on the NC thin film device.