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Sealed body, light-emitting module, and method of manufacturing sealed body

專利號
US10096741B2
公開日期
2018-10-09
申請人
Semiconductor Energy Laboratory Co., Ltd.(JP)
發(fā)明人
Yusuke Nishido
IPC分類
H01L23/28; H01L23/29; H01L33/00; H01L33/56; H01L51/00; H01L51/52; H01L51/56
技術領域
sealant,emitting,substrate,light,region,sealed,layer,ray,in,energy
地域: Kanagawa-ken

摘要

A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.

說明書

This application is a continuation of copending U.S. application Ser. No. 13/686,252, filed on Nov. 27, 2012 which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a sealed body. Further, the present invention relates to a light-emitting module in which a light-emitting element is sealed. Furthermore, the present invention relates to a method of manufacturing the sealed body.

2. Description of the Related Art

There is a known technique in which an object is sealed in a sealed body so that characteristics of the object are prevented from being degraded due to impurities from the outside.

In the case where the heat resistance of the object sealed in the sealed body is low, the temperature in the sealing step is desirably low so that damage to the object is reduced. In general, an organic material such as a resin can be solidified or cured at lower temperature than an inorganic material such as ceramics or glass, and is more advantageous in lowering the temperature in the sealing step.

On the other hand, as for a material used for a sealant, the diffusion rate of impurities therein is preferably lower. In general, an inorganic material has lower density than an organic material and has low diffusion rate of substances; thus, an inorganic material is suitable for the sealant.

權利要求

1
What is claimed is:1. A light-emitting device comprising:a first substrate;a second substrate which is capable of transmitting an energy ray and is over the first substrate;a sealed object between the first substrate and the second substrate;a sealant surrounding the sealed object, the sealant attaching the first substrate to the second substrate; anda plurality of metal layers overlapping with the sealant, each of the plurality of metal layers comprising a metal element selected from aluminum, copper, chromium, tantalum, titanium, molybdenum, or tungsten and having higher reflectivity with respect to the energy ray than the first substrate,wherein the sealant includes a glass,wherein, in a top view of the light-emitting device, a first part of the sealant extends in a first direction, a second part of the sealant extends in a second direction substantially orthogonal to the first direction, and a corner of the sealant is located between the first part of the sealant and the second part of the sealant, andwherein the plurality of metal layers are arranged in stripe and obliquely intersect the corner of the sealant to cross both of the first part of the sealant and the second part of the sealant.2. The light-emitting device according to claim 1,wherein the sealed object is at least one of an electronic element, a light-emitting element including a layer containing a light-emitting organic compound, a circuit element, a memory element, and an arithmetic element.3. The light-emitting device according to claim 1,wherein the energy ray includes at least one of an electron beam, a light beam, a microwave beam, and an ultrasonic beam.4. The light-emitting device according to claim 1,wherein the first substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, or a substrate formed of a prepreg, andwherein the second substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, a substrate formed of a prepreg, a quartz substrate, a sapphire substrate, or a substrate formed of polyvinyl fluoride.5. The light-emitting device according to claim 1,wherein the plurality of metal layers comprises a connection terminal, an antenna, or a coil of the sealed object.6. A light-emitting device comprising:a first substrate;a second substrate;a sealant attaching the first substrate to the second substrate; anda plurality of metal layers overlapping with the sealant, each of the plurality of metal layers comprising a metal element selected from aluminum, copper, chromium, tantalum, titanium, molybdenum, or tungsten,wherein, in a top view of the light-emitting device, a first part of the sealant extends in a first direction, a second part of the sealant extends in a second direction substantially orthogonal to the first direction, and a corner of the sealant is located between the first part of the sealant and the second part of the sealant,wherein the plurality of metal layers are arranged in stripe and obliquely intersect the corner of the sealant to cross both of the first part of the sealant and the second part of the sealant, andwherein the plurality of metal layers obliquely intersecting the corner of the sealant are arranged at intervals which are different from intervals of the plurality of metal layers along the first part of the sealant and the second part of the sealant.7. The light-emitting device according to claim 6, wherein the sealant includes a glass.8. The light-emitting device according to claim 6,wherein the first substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, or a substrate faulted of a prepreg, andwherein the second substrate is a glass substrate, a ceramic substrate, a metal substrate, a lamination of a resin substrate and an inorganic material, a substrate formed of fiberglass-reinforced plastics, a substrate formed of a prepreg, a quartz substrate, a sapphire substrate, or a substrate formed of polyvinyl fluoride.9. The light-emitting device according to claim 6,wherein the plurality of metal layers comprises a connection terminal, an antenna, or a coil of a sealed object interposed between the first substrate and the second substrate.
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