Sealed body, light-emitting module, and method of manufacturing sealed body
摘要
說明書
In the light-emitting module according to one embodiment of the present invention, even a light-emitting element whose reliability is likely to be impaired due to diffusion of impurities in the air and which does not have heat resistance high enough to withstand the sealing step performed at high temperature can be sealed without being exposed to high temperature. As a result, a highly reliable light-emitting module in which sealing is uniformly performed can be provided.
Another embodiment of the present invention is an electronic device including the light-emitting module.
The electronic device according to one embodiment of the present invention includes a highly reliable light-emitting module in which sealing is uniformly performed. As a result, a highly reliable electronic device can be provided.
Another embodiment of the present invention is a method of manufacturing a sealed body. The method includes a first step and a second step.
The first step includes the steps of preparing a first substrate provided with, on its one surface, a high-reflectivity region capable of reflecting part of an energy ray and a low-reflectivity region having lower reflectivity with respect to the energy ray than the high-reflectivity region; preparing a second substrate capable of transmitting the energy ray; preparing a sealed object; and preparing a sealant which surrounds the sealed object, includes a low-melting-point glass layer absorbing part of the energy ray at a position overlapping with the high-reflectivity region and the low-reflectivity region, and is provided on the one surface of the first substrate or one surface of the second substrate.
