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Sealed body, light-emitting module, and method of manufacturing sealed body

專利號
US10096741B2
公開日期
2018-10-09
申請人
Semiconductor Energy Laboratory Co., Ltd.(JP)
發(fā)明人
Yusuke Nishido
IPC分類
H01L23/28; H01L23/29; H01L33/00; H01L33/56; H01L51/00; H01L51/52; H01L51/56
技術(shù)領(lǐng)域
sealant,emitting,substrate,light,region,sealed,layer,ray,in,energy
地域: Kanagawa-ken

摘要

A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.

說明書

The first substrate 101 is alternately provided with a high-reflectivity region 105a capable of reflecting part of the energy ray and a low-reflectivity region 105b having lower reflectivity with respect to the energy ray than the high-reflectivity region 105a which overlap with the sealant 131. The sealant 131 includes a low-melting-point glass layer absorbing part of the energy ray.

In the sealed body 100 illustrated in FIGS. 1A to 1C, the high-reflectivity region 105a and the low-reflectivity region 105b alternately intersect the sealant 131, and extend outside the sealant 131. A first connection terminal 103 and a second connection terminal 104 are each electrically connected to the sealed object 110.

A function and an effect of the structure of the sealed body 100 according to one embodiment of the present invention will be described with reference to a sealed body which is manufactured in such a manner that the sealant 131 is irradiated with the energy ray from the second substrate 102 side while scanning is performed along the sealant 131.

權(quán)利要求

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