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Sealed body, light-emitting module, and method of manufacturing sealed body

專利號(hào)
US10096741B2
公開(kāi)日期
2018-10-09
申請(qǐng)人
Semiconductor Energy Laboratory Co., Ltd.(JP)
發(fā)明人
Yusuke Nishido
IPC分類
H01L23/28; H01L23/29; H01L33/00; H01L33/56; H01L51/00; H01L51/52; H01L51/56
技術(shù)領(lǐng)域
sealant,emitting,substrate,light,region,sealed,layer,ray,in,energy
地域: Kanagawa-ken

摘要

A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.

說(shuō)明書(shū)

A light-emitting module 200 illustrated in FIGS. 3A to 3D includes a first substrate 201, a second substrate 202 capable of transmitting an energy ray, a light-emitting element 210 between the first substrate 201 and the second substrate 202, and a sealant 231 which surrounds the light-emitting element 210 and with which the first substrate 201 and the second substrate 202 are attached to each other. The light-emitting element 210 includes a first electrode 211, a second electrode 212, and a layer 213 containing a light-emitting organic compound therebetween. In particular, the first substrate 201 is alternately provided with a high-reflectivity region 205a capable of reflecting part of the energy ray and a low-reflectivity region 205b having lower reflectivity with respect to the energy ray than the high-reflectivity region 205a which overlap with the sealant 231. The sealant 231 includes a low-melting-point glass layer absorbing part of the energy ray.

Components of the light-emitting module in this embodiment will be described below.

<First Substrate and Second Substrate>

The first substrate 201 and the second substrate 202 each have heat resistance high enough to withstand a manufacturing process of the light-emitting module. The first substrate 201 and the second substrate 202 are not particularly limited in thickness and size as long as they can be used in a manufacturing apparatus. Further, the first substrate 201 and the second substrate 202 may have a single-layer structure or a layered structure of two or more layers.

權(quán)利要求

1
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