Sealed body, light-emitting module, and method of manufacturing sealed body
摘要
說明書
Note that this embodiment can be combined with any of the other embodiments in this specification as appropriate.
In this embodiment, a method of manufacturing the sealed body in Embodiment 1 according to one embodiment of the present invention will be described. Specifically, the method includes a first step and a second step.
The first step includes the steps of preparing a first substrate provided with, on its one surface, a high-reflectivity region capable of reflecting part of an energy ray and a low-reflectivity region having lower reflectivity with respect to the energy ray than the high-reflectivity region; preparing a second substrate capable of transmitting the energy ray; preparing a sealed object; and preparing a sealant which surrounds the sealed object, includes a low-melting-point glass layer absorbing part of the energy ray at a position overlapping with the high-reflectivity region and the low-reflectivity region, and is provided on the one surface of the first substrate or one surface of the second substrate.
The second step is a step of sealing the sealed object between the first substrate and the second substrate by performing irradiation with the energy ray from the other surface side of the second substrate while scanning is performed along the sealant in a state where the sealant is interposed between the one surface of the first substrate and the one surface of the second substrate.
