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Sealed body, light-emitting module, and method of manufacturing sealed body

專利號(hào)
US10096741B2
公開(kāi)日期
2018-10-09
申請(qǐng)人
Semiconductor Energy Laboratory Co., Ltd.(JP)
發(fā)明人
Yusuke Nishido
IPC分類
H01L23/28; H01L23/29; H01L33/00; H01L33/56; H01L51/00; H01L51/52; H01L51/56
技術(shù)領(lǐng)域
sealant,emitting,substrate,light,region,sealed,layer,ray,in,energy
地域: Kanagawa-ken

摘要

A sealed body in which sealing is uniformly performed is provided. A light-emitting module in which sealing is uniformly performed is provided. A method of manufacturing the sealed body in which sealing is uniformly performed is provided. The sealed body comprises a first substrate alternately provided with a high-reflectivity region with respect to the energy ray and a low-reflectivity region with respect to the energy ray so as to overlap with a sealant surrounding a sealed object, and a second substrate capable of transmitting the energy ray. The sealed object is sealed between the first substrate and the second substrate by heating the sealant with irradiation with the energy ray through the second substrate.

說(shuō)明書(shū)

In this embodiment, a substrate capable of transmitting the energy ray is prepared as the second substrate 102. In the case where a light-emitting module as the sealed body in which a light-emitting element is sealed is manufactured, a color filter or the like may be provided in advance so as not to overlap with the sealant.

The sealed object 110 is formed over the first substrate 101, and is electrically connected to the first connection terminal 103 and the second connection terminal 104. Alternatively, the sealed object 110 may be manufactured separately, and then may be electrically connected to the first connection terminal 103 and the second connection terminal 104.

The sealant 131 is formed so as to surround the sealed object 110 and overlap with the high-reflectivity region and the low-reflectivity region. In this embodiment, the case where the sealant 131 is formed on one surface of the second substrate 102 is described as an example; however, the sealant 131 may be formed on the one surface of the first substrate 101.

The sealant 131 is formed in such a manner that a dispersing element including a low-melting-point glass powder, an organic resin, and a solvent is formed so as to form a frame on the one surface of the second substrate by a screen printing method, a dispenser method, or the like. Next, heating and baking are performed so as to remove the organic resin and the solvent. In such a manner, the sealant 131 is formed.

<Second Step>

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