Sealed body, light-emitting module, and method of manufacturing sealed body
摘要
說明書
In this embodiment, a structure of a light-emitting panel which is one mode of a light-emitting module according to one embodiment of the present invention will be described. Specifically, the light-emitting panel in this embodiment has the following structure: a light-emitting element including a layer containing a light-emitting organic compound between a first electrode and a second electrode is sealed as a sealed object in a sealed body including a first substrate, a second substrate capable of transmitting an energy ray, the sealed object between the first substrate and the second substrate, and a sealant which surrounds the sealant and with which the first substrate and the second substrate are attached to each other. In particular, the first substrate is alternately provided with a high-reflectivity region capable of reflecting part of the energy ray and a low-reflectivity region having lower reflectivity with respect to the energy ray than the high-reflectivity region which overlap with the sealant. The sealant includes a low-melting-point glass layer absorbing part of the energy ray.
In the light-emitting panel described in this embodiment, even a light-emitting element whose reliability is likely to be impaired due to diffusion of impurities in the air and which does not have heat resistance high enough to withstand the sealing step performed at high temperature can be sealed without being exposed to high temperature. As a result, a highly reliable light-emitting panel in which sealing is uniformly performed can be provided. In the light-emitting panel, the light-emitting element with low heat resistance can be sealed without being damaged.
