In certain embodiments, the component further includes an array of outcoupling features on a surface of the substrate SUB opposite the color conversion material CCM.
In certain embodiments, at least a portion of the outcoupling features are configured to have predetermined outcoupling angles.
In certain embodiments, at least a portion of the outcoupling features include a substantially hemispherical surface.
In certain embodiments, at least a portion of the outcoupling features include a curved surface.
In certain embodiments, at least a portion of the features are printed.
In certain embodiments, features can be printed by screen-printing, contract printing, or inkjet printing.
In certain embodiments of films, components, and devices described herein, color conversion material CCM further comprises a host material in which the quantum dots are dispersed. A non-limiting list of examples of host materials are described below.
In certain embodiments, color conversion material CCM further comprises a binder in which the quantum dots are dispersed.
In certain embodiments, color conversion material CCM has an index of refraction greater than or equal to the index of refraction of the conductive material.