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Semiconductor device package

專利號
US10096760B2
公開日期
2018-10-09
申請人
LG INNOTEK CO., LTD.（KR Seoul）
發(fā)明人
Eun Joo Kim; Ga Yeon Kim; Nak Hun Kim; Jung Hwan Son; Young Hyun Jeon
IPC分類
F21V5/00; H01L33/64; F21V5/04; H01L33/60; H01L33/62; H01L33/38; H01L33/58; F21Y115/10; H01L33/50
技術領域
electrode,may,reflection,layer,first,unit,light,emitting,protrusion,region
地域： Seoul

摘要

A semiconductor device package and a lighting device including a semiconductor device package are provided. The semiconductor device package may include a substrate, a first electrode module provided on the substrate, a light emitting device provided in a first region of the first electrode module, a second electrode module electrically disconnected from the first electrode module and provided on the substrate, and an insulating reflection layer provided on a circumference of the light emitting device between the first electrode module and the second electrode module and having a polygonal shape.

說明書

Referring to FIG. 1 and FIG. 2, the semiconductor device package 200 may include the insulating reflection layer 230 provided around the light emitting device 100 between the first electrode unit 210 and the second electrode unit 220 and having a polygonal shape. Due to a discoloration of a plating layer provided on a substrate, light reflection efficiency may be reduced, or electrical reliability may be reduced. In order to solve such problems, the semiconductor device package 200 according to an embodiment may include the insulating reflection layer 230 provided around the light emitting device 100 and having the polygonal shape, and the insulating reflection layer 230 may be provided between the first electrode unit 210 and the second electrode unit 220.

Since the semiconductor device package 200 includes the insulating reflection layer 230 provided around the light emitting device 100 between the first electrode unit 210 and the second electrode unit 220 and having a polygonal shape, a region of each of the first and second electrode units 220 and 230 where discoloration may occur may be minimized, and moreover, the insulating reflection layer 230, which may have good thermal and electrical reliability, may be provided around the light emitting device 100, thereby solving a problem where light speed may be reduced due to discoloration of a plating layer of a substrate and a problem where electrical reliability may be reduced due to a discoloration of a plating layer of a substrate.

權利要求

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