Materials of the first and second electrode units 210 and 220 may be primarily formed in a region other than a region where a light emitting chip is to be formed on a substrate, and then, materials of the first and second electrode units may be removed from a region where the insulating reflection layer 230 is to be formed, whereupon the insulating reflection layer 230 may be formed. The materials of the first and second electrode units 210 and 220 may be formed in only the region where the insulating reflection layer 230 is to be formed, and the insulating reflection layer 230 may be formed in a region where the insulating reflection layer 230 is to be formed. Therefore, a height of each of the first and second electrode units 210 and 220 and a height of the insulating reflection layer 230 may be provided on a same horizontal surface, or the height of the insulating reflection layer 230 may be set differently from that of each of the first and second electrode units 210 and 220. The height of the insulating reflection layer 230 may be adjusted in consideration of thermal stability based on heat transferred from the first and second electrode units 210 and 220 to the insulating reflection layer 230.