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Semiconductor device package

專利號
US10096760B2
公開日期
2018-10-09
申請人
LG INNOTEK CO., LTD.(KR Seoul)
發(fā)明人
Eun Joo Kim; Ga Yeon Kim; Nak Hun Kim; Jung Hwan Son; Young Hyun Jeon
IPC分類
F21V5/00; H01L33/64; F21V5/04; H01L33/60; H01L33/62; H01L33/38; H01L33/58; F21Y115/10; H01L33/50
技術(shù)領(lǐng)域
electrode,may,reflection,layer,first,unit,light,emitting,protrusion,region
地域: Seoul

摘要

A semiconductor device package and a lighting device including a semiconductor device package are provided. The semiconductor device package may include a substrate, a first electrode module provided on the substrate, a light emitting device provided in a first region of the first electrode module, a second electrode module electrically disconnected from the first electrode module and provided on the substrate, and an insulating reflection layer provided on a circumference of the light emitting device between the first electrode module and the second electrode module and having a polygonal shape.

說明書

The width W3 of the fifth region 210b of the first electrode unit 210 in the second axis (Y) direction may be within a range of about 2/10 to about 3/10 of the width W1 of the first region 210a of the first electrode unit 210 in the first axis (X) direction. For example, the width W3 of the fifth region 210b of the first electrode unit 210 in the second axis (Y) direction may be about 0.24 mm to about 0.36 mm, but is not limited thereto. When the width W3 of the fifth region 210b in the second axis (Y) direction is less than 2/10 of the width W1 of the first region 210a in the first axis (X) direction, a width of a lead electrode may be narrowed, and resistance may increase. When the width W3 of the fifth region 210b in the second axis (Y) direction is more than 3/10 of the width W1 of the first region 210a in the first axis (X) direction, the width of the lead electrode may be considerably widened, causing the reduction in thermal dissipation efficiency.

權(quán)利要求

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