Semiconductor device package
摘要
說明書
A curved part R between the lens part 261 and the buffer part 262 of the optical lens 260 may have a curvature radius which may be within a range of about 0.2±0.02 mm. A center of a radius of the curved part R between the lens part 261 and the buffer part 262 may be provided on the buffer part 262. An upper surface of the buffer part 262 may be provided lower in position than an extension line of an upper surface of the light emitting chip 110.
The semiconductor device package 202 may include a first electrode unit 210 provided on a substrate 201, a light emitting device 100 provided on the first electrode unit 210, a second electrode unit 220 electrically disconnected from the first electrode unit 210 and provided on the substrate 201, an insulating reflection layer 230 provided on a circumference of the light emitting device 100 between the first electrode unit 210 and the second electrode unit 220 and having a polygonal shape, and a resin reflection layer 250 provided on a side circumference of the light emitting device 100.
