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Laterally grown edge emitting laser

專利號(hào)
US10096975B1
公開日期
2018-10-09
申請(qǐng)人
INTERNATIONAL BUSINESS MACHINES CORPORATION(US NY Armonk)
發(fā)明人
Effendi Leobandung; Ning Li
IPC分類
H01S5/343; H01S5/30; H01S5/02
技術(shù)領(lǐng)域
layer,iii,doped,cladding,optical,dielectric,may,substrate,structure,silicon
地域: NY NY Armonk

摘要

A laterally grown edge emitting laser is provided. A semiconductor structure is disposed on a substrate. A first, a second and a third III-V optical layers are sequentially and laterally grown on and from a sidewall of the semiconductor structure. A cladding semiconductor layer is disposed next to the third III-V optical layer and electrically connected to the III-V optical layer. Then, a first contact structure and a second contact structure is disposed on and electrically connected to the semiconductor structure and the cladding semiconductor layer, respectively. In the edge emitting laser, each of the first, second and third III-V optical layers may independently include a III-V semiconductor including at least one of group III elements of boron (B), gallium (Ga), aluminum (Al) and indium (In), and at least one of group V elements of nitrogen (N), phosphorus (P), arsenic (As), antimony (Sb) and bismuth (Bi). The laterally grown edge emitting laser may be integrated with a metal-oxide-semiconductor field-effect transistor (MOSFET). A method for manufacturing the laterally grown edge emitting laser is also provided.

說明書

Materials currently used in manufacturing edge emitting laser include Group III-V semiconductors, particularly binary, ternary, and quaternary alloys of group III elements such as gallium, aluminum, and indium, and group V elements such as nitrogen, phosphorus, arsenic, and antimony. The edge emitting laser including III-V semiconductors may be fabricated by epitaxially growing a stack of semiconductor layers of different compositions and dopant concentrations on a substrate. In other words, these semiconductor layers are stacked from the substrate in a direction perpendicular to the substrate. One or more n-type layers may be formed on the substrate and one or more p-type layers may be formed over the one or more n-type layers with one or more layers of an active region formed therebetween. Electrical contacts are formed to connect the n-type and the p-type regions. Laser waveguide is formed using materials with different refractive indexes to confine the light. Light feedback loop is achieved by end mirrors at the end of the cavity or distributed mirrors along the laser waveguide.

SUMMARY OF THE INVENTION

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