According to embodiments of the present disclosure, the busbar can be connected to the contact element via a contact plate, particularly a tiered contact plate, to further improve the electrical connection between the electrical conductor and the contact element. Broader contact zones can be created in this way for an improved mechanical and electrical bond. The tier of the contact plate is adapted to fit the shape of the contact element (where the tier height corresponds to the thickness of the contact element). If the electrical conductor is a round conductor made of aluminum, for example, it is flattened in the area of the bonding with the contact plate.

The described properties of the present disclosure and the manner in which these are achieved will be described in more detail based on the following detailed description. The foregoing general description and the following detailed description are exemplary and explanatory only, and are not restrictive of embodiments consistent with the present disclosure. Further, the accompanying drawings illustrate embodiments of the present disclosure, and together with the description, serve to explain principles of the present disclosure.