The invention claimed is:1. An electric assembly to be mounted on a top-hat rail, comprising:an electrical power supply component comprising:a plurality of electrical components arranged on a multilayer carrier;wherein the multilayer carrier comprises:a top on which the electrical components are arranged;a bottom, opposite the top and configured as a mating surface;a metal plate,a conductor-track layer for making electrical contact with the electrical power supply component, andan electrical insulation layer which is arranged between the metal plate and the conductor-track layer, wherein the electrical insulation layer is a thermally conductive dielectric layer;wherein the metal plate substantially covers the insulation layer, andwherein the electrical power supply component is thermally conductively connected to the metal plate in order to dissipate thermal energy from the electrical power supply component;a housing configured to house the multilayer carrier and the electrical power supply component, wherein the housing includes a housing section that acts as a heat sink and is thermally conductively connected to the metal plate; andwherein the heatsink is (i) configured to dissipate thermal energy generated by the electrical power supply component, (ii) formed in one piece and in a materially integral manner from a polymer, (iii) has two lateral limits, which are configured to position the electrical power supply component, and (iv) has a contact surface, which is in contact with the mating surface of the multilayer carrier, wherein the contact surface is configured as an elastically deformable section of the heatsink.2. The electric assembly of claim 1, wherein at least one of the metal plate and the conductor-track layer is formed from at least one of the following materials:aluminum, copper, aluminum-containing alloy, and copper-containing alloy.3. The electric assembly of claim 1, wherein the conductor-track layer is formed by electrical conductor tracks.4. The electric assembly of claim 1, wherein the metal plate is provided as a shield for an alternating electromagnetic field emitted by the electrical power supply component.5. The electric assembly of claim 1, wherein the metal plate is configured to shield alternating electromagnetic fields with a frequency of up to 30 MHz.6. The electric assembly of claim 1, wherein the metal plate expands to substantially cover an area corresponding to electrical components of the electrical power supply component.7. The electric assembly of claim 1, wherein the metal plate is connectable to a reference potential.8. The electric assembly of claim 1, wherein the electrical power supply component is a switched-mode power supply.9. The electric assembly of claim 1, wherein the metal plate expands to substantially cover an area corresponding to at least a switched-mode power supply.10. The electrical assembly of claim 1, wherein the metal plate is connectable to a ground potential.11. An electric assembly to be mounted on a top-hat rail comprising:an electrical power supply component comprising:a plurality of electrical components arranged on a multilayer carrier;wherein the multilayer carrier comprises:a top on which the electrical components are arranged;a bottom, opposite the top and configured as a mating surface;a metal plate;a conductor-track layer for making electrical contact with the electrical power supply component;a housing which is provided to house the multilayer carrier and the electrical power supply component, wherein the housing includes a housing section that that acts as a heat sink and is thermally conductively connected to the metal plate;an electrical insulation layer which is arranged between the metal plate and the conductor-track layer, wherein the electrical insulation layer is a thermally conductive dielectric layer; andwherein the heatsink is (i) configured to dissipate thermal energy generated by the electrical power supply component, (ii) formed in one piece and in a materially integral manner from a polymer, (iii) has two lateral limits, which are configured to position the electrical power supply component, and (iv) has a contact surface, which is in contact with the mating surface of the multilayer carrier,wherein the contact surface is configured as an elastically deformable section of the heat sink;wherein the metal plate substantially covers the insulation layer; andwherein the electrical power supply component is thermally conductively connected to the metal plate in order to dissipate thermal energy from the electrical power supply component.
