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Printed circuit board

專(zhuān)利號(hào)
US10154594B2
公開(kāi)日期
2018-12-11
申請(qǐng)人
SAMSUNG ELECTRO-MECHANICS CO., LTD.（KR Suwon-si）
發(fā)明人
Jeong-Ho Lee; Young-Do Kweon; Hyoung-Joon Kim; Kyoung-Moo Harr; Kyung-Seob Oh
IPC分類(lèi)
H05K1/11; H05K3/00; H05K1/18; H05K3/40; H01L23/52; H05K3/46
技術(shù)領(lǐng)域
board,circuit,patterns,layers,25b,25a,printed,connection,15b,15a
地域： Suwon-si

摘要

A printed circuit board including a circuit board having a cavity between an upper surface of the circuit board and a lower surface of the circuit board that are substantially parallel to each other, and a connection board including insulating layers substantially parallel with metal layers, the metal layers including metal patterns. The connection board is disposed in the cavity with the insulating layers and the metal layers of the connection board substantially perpendicular to the upper and lower surfaces of the circuit board.

說(shuō)明書(shū)

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit under 35 USC 119(a) of Korean Patent Application No. 10-2015-0056524 filed on Apr. 22, 2015, in the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes.

BACKGROUND

1. Field

The following description relates to a printed circuit board, a method of manufacturing the printed circuit board, and an electronic component module.

2. Description of Related Art

Recently, mobile devices and tablet PCs have become increasingly more functional and integrated as well as becoming smaller and lighter. Thus, the core components of these mobile devices, such as CPU, GPU and AP, have also become more functional and integrated. Various techniques and structures have been studied to reduce the size of the core components in order to implement package substrates having fine patterns with a pattern width of 3 μm or less. For instance, U.S. Patent Publication No. 2011/0103030 described an example of a technique for minimizing the size of core components.

SUMMARY

This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

權(quán)利要求

1
What is claimed is:1. A printed circuit board comprising:a circuit board comprising first insulating layers, first metal layers, and a cavity between an upper surface of the circuit board and a lower surface of the circuit board that are substantially parallel to each other; anda connection board comprising second insulating layers substantially parallel with second metal layers, the second metal layers comprising metal patterns,wherein the connection board is disposed in the cavity with the second insulating layers and the second metal layers of the connection board substantially perpendicular to the first metal layers and first insulation layers of the circuit board, and the second metal layers of the connection board extending from an upper surface to a lower surface of the connection board,wherein the second metal layers of the connection board are connected to an electronic component to provide an electrical connection between the upper surface of the circuit board and the lower surface of the connection board.2. The printed circuit board as set forth in claim 1, wherein the metal patterns of the connection board are configured to provide an electrical connection between the upper surface and the lower surface of the circuit board.3. The printed circuit board as set forth in claim 1, wherein the metal patterns comprise signal lines for connecting a plurality of electronic components.4. The printed circuit board as set forth in claim 1, wherein the metal patterns disposed in the connection board each have a rectangular cross-sectional shape.5. The printed circuit board as set forth in claim 1, wherein the connection board comprises a plurality of resin insulation layers, andthe metal patterns are formed, respectively, on the plurality of insulation layers.6. The printed circuit board as set forth in claim 1, wherein the connection board has a rectangular prism shape.7. The printed circuit board as set forth in claim 1, further comprising a solder resist layer formed on the circuit board having the connection board disposed therein.8. The printed circuit board as set forth in claim 1, further comprising a resin filled between the connection board and the cavity.9. The printed circuit board as set forth in claim 1, further comprising a solder resist layer disposed on at least one of the upper surface and the lower surface,wherein ends of the metal patterns are exposed through the solder resist layer.10. The printed circuit board as set forth in claim 8, wherein the resin comprises a solder resist.11. A printed circuit board comprising:a circuit board comprising first insulating layers, first metal layers, and a cavity between an upper surface of the circuit board and a lower surface of the circuit board that are substantially parallel to each other; anda connection board comprising second insulating layers substantially parallel with second metal layers, the second metal layers comprising metal patterns, and the second metal layers extending from an upper surface to a lower surface of the connection board,wherein the connection board is disposed in the cavity with the second metal layers of the connection board disposed at an angle converging with the upper and lower surfaces of the circuit board,wherein the second metal layers of the connection board are connected to an electronic component to provide an electrical connection between the upper surface of the circuit board and the lower surface of the connection board.
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