Referring to FIG. 7, the printed circuit board includes a circuit board 100 and a connection board 10B placed through a cavity of the circuit board 100.

The circuit board 100 is a multilayered printed circuit board that includes a plurality of circuit layers and a plurality of insulation layers interposed, respectively, between the plurality of circuit layers for insulating the plurality of circuit layers from one another.

The circuit board 100 also includes a blind via and a through via for interlayer connection of the circuit layers.

The connection board 10B includes a plurality of insulation layers 11, 21 and a plurality of metal patterns 15a, 15b, 25a, 25b formed on the plurality of insulation layers 11, 21.

The plurality of metal patterns 15a, 15b, 25a, 25b are interconnected by connection patterns 27a, 27b.

The metal patterns 15a, 15b, 25a, 25b of the connection board 10B are received in the circuit board 100 in the vertical direction to function as an interconnection between an upper surface and a lower surface of the printed circuit board.

In this example, at least one build-up layer including a build-up insulation layer 160 and a build-up circuit layer 165 is formed on the circuit board 100 having the connection board 10B received therein.