Also, the capacitance value of the capacitor AC1 shown in FIG. 2 is determined by the area of the region where the conductor pattern MPc and the conductor pattern MPg shown in FIG. 3 face each other. For example, in a case where a planar shape of the conductor pattern MPc shown in FIG. 1 is a shape which slenderly extends like the wire 11A, a resistance element and an inductance element provided to the conductor pattern MPc are increased. From a viewpoint of reducing the resistance element and the inductance element provided to the conductor pattern MPc, it is preferable that the conductor pattern MPc has a low aspect ratio in plan view. For example, according to the present embodiment, as shown in FIG. 4, the conductor pattern MPc has a longer side (side) MPs1 extending in the X direction, and a longer side MPs2 located opposite to the longer side MPs1. FIG. 4 is an overlapping plan view extracting the wires connected to the sensor, the board terminals, and the conductor pattern connected to the wire, which are shown in FIG. 1. Also, the conductor pattern MPc has a shorter side MPs3 extending in the Y direction which crosses the X direction, and a shorter side MPs4 located opposite to the shorter side MPs3. A length of each of the longer sides MPs1 and MPs2 is larger than a length of each of the shorter sides MPs3 and MPs4. Also, in the Y direction, a separation distance (width W1) between the longer side MPs1 and the longer side MPs2 is larger than a width W2 of the extending portion 11L1 of the wire 11A. In other words, the conductor pattern MPc has a width larger than that of the wire 11A. Accordingly, the resistance element and the inductance element provided to the conductor pattern MPc can be reduced.
