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Electronic device

專利號(hào)
US10165673B2
公開日期
2018-12-25
申請(qǐng)人
Renesas Electronics Corporation(JP Tokyo)
發(fā)明人
Tatsuaki Tsukuda
IPC分類
H05K1/02; H03H7/01; H05K1/11; H05K1/18
技術(shù)領(lǐng)域
conductor,wiring,wire,board,in,pattern,terminal,mpc,fig,mpg
地域: Koutou-ku, Tokyo

摘要

A wiring board of an electronic device includes: a board terminal connected to a semiconductor device (semiconductor component); a wire formed in a first wiring layer and electrically connected to the board terminal; a conductor pattern formed in a second wiring layer and electrically connected to the wire via a via wire; and another conductor pattern formed in a third wiring layer and supplied with a first fixed potential. The conductor pattern and the another conductor pattern face each other with an insulating layer interposed therebetween, and an area of a region where the conductor pattern and the another conductor pattern face each other is larger than an area of the wire.

說(shuō)明書

Also, as another modification example of the electronic device EDV1, a configuration of an electronic device EDV3 shown in FIG. and FIG. 7 can be exemplified. FIG. 6 is an enlarged cross-sectional view of an electronic device according to a modification example of FIG. 3. FIG. 7 is an overlapping plan view showing the modification example of FIG. 4, in the electronic device shown in FIG. 6.

權(quán)利要求

1
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