FIG. 11 is an enlarged plan view showing an example of a configuration of an electronic device in which the EMI countermeasure is taken for a power semiconductor component. FIG. 12 is a diagram of an equivalent circuit of a path electrically connecting a semiconductor component including an amplifier circuit and a power semiconductor component supplying an electric power to the semiconductor component, which are shown in FIG. 11. FIG. 13 is an enlarged cross-sectional view taken along a line A-A shown in FIG. 11.
An electronic device EDV6 shown in FIG. 11 includes a semiconductor device 20, a semiconductor device (semiconductor component, electronic component) 60 supplying a power-supply potential to the semiconductor device 20, and a wiring board 10 on which the semiconductor device 20 and the semiconductor device 60 are mounted. The semiconductor device 60 includes an inverter INV which is an electric power conversion circuit. The inverter INV performs processing on an electric power which is externally input, and outputs the electric power on which the processing has been performed. As an example of the foregoing processing, processing of stepping up or down an externally-input potential and outputting a potential different from the input potential is cited. Also, as another example of the foregoing processing, processing of converting input direct-current power supply to alternating-current power supply and outputting it is cited. The semiconductor device 60 is a semiconductor device for power management, which controls an electric power supplied to an electronic component included in the electronic device EDV6.
