Stencil printing was used to apply a layer of a silver sintering paste (ASP 043-04P2 from Heraeus Materials Technology) sized 10×10 mm² onto a support substrate in the form of a polytetrafluoroethylene film at a wet layer thickness of 100 μm, which was then sintered for 30 min in a circulating-air drying cabinet at an object temperature of 250° C.

The sintered product was carefully detached from the support substrate using a suction pipette to obtain a free layer-shaped silver sintering body.

A 10 wt % aqueous sodium carbonate solution was placed in a stainless steel vessel and the stainless steel vessel was connected to the cathode of a 10 V direct voltage source. The anode of the voltage source was connected to the free layer-shaped silver sintering body and the latter was then immersed in the sodium carbonate solution for 30 seconds.

Once it was taken out, the blackened surface of the free layer-shaped silver sintering body resulting from anodic oxidation was rinsed with deionized water and then dried. Subsequently, one droplet of a 2 wt. % lauric acid solution in Exxsol D60 was placed on the silver oxide surfaces on the front and rear side, distributed evenly, and dried in a circulating-air heating cabinet at 70° C. Then the silver sintering body thus provided with lauric acid was joined between the gold surface of a corresponding DCB substrate and the silver contact surface of an IGBT sized 10×10 mm² and the sandwich arrangement thus produced was sintered in a sintering press for 120 seconds at an object temperature of 250° C. and a mechanical pressure of 20 MPa.