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Printed wiring board

專利號(hào)
US10791622B2
公開日期
2020-09-29
申請(qǐng)人
National University Corporation Okayama University; KYOCERA Corporation（JP Okayama JP Kyoto）
發(fā)明人
Yoshitaka Toyota; Kengo Iokibe; Xingxiaoyu Lin; Toshiyuki Kaneko; Masanori Naito; Toshihisa Uehara
IPC分類
H05K1/00; H05K1/02; H05K1/11; H05K1/16; H05K9/00; H01P1/16; H01P1/20; H01P1/203; H01L31/00; H05K3/46
技術(shù)領(lǐng)域
ebg,capacitive,layer,supply,coupling,power,element,wire,in,branch
地域： Okayama-shi, Okayama

摘要

A printed wiring board of the present disclosure that includes a power supply layer and a ground layer. A power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EBG) unit cells. A capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer provided therebetween.

說(shuō)明書

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
TECHNICAL FIELD

The present disclosure relates to a printed wiring board having an electromagnetic band gap structure.

BACKGROUND ART

A multilayer printed wiring board having a noise suppression part or noise propagation suppression is considered to be used for suppressing parallel plate resonance or high-frequency noise propagation generated between a power supply layer and a ground layer in the multilayer printed wiring board. Normally a capacitor is used for reducing noises in a power supply system in the multilayer printed wiring board. On the other hand, an electromagnetic band gap (EBG) structure is used between the power supply layer and the ground layer in order to suppress noise propagation. Such printed wiring boards utilizing such an EBG structure are disclosed in, for example, Patent Documents 1 to 5.

RELATED ART DOCUMENT Patent Document

Patent Document 1: Japanese Unexamined Patent Publication No. 2010-10183

Patent Document 2: Japanese Unexamined Patent Publication No. 2013-58585

Patent Document 3: Japanese Unexamined Patent Publication No. 2013-183082

Patent Document 4: Japanese Unexamined Patent Publication No. 2013-255259

Patent Document 5: Japanese Unexamined Patent Publication No. 2014-27559

SUMMARY OF THE INVENTION

權(quán)利要求

1
The invention claimed is:1. A printed wiring board comprising:a power supply layer, a via, and a ground layer,wherein a power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EGB) unit cells,wherein a capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer being provided between the capacitive coupling element and the power supply layer electrode,wherein the power supply layer pattern further includes a power supply layer wire that extends from the power supply layer electrode to surround at least a portion of a periphery of the power supply layer electrode, or the capacitive coupling element further includes a capacitive coupling element wire that extends from the capacitive coupling element body to surround at least a portion of a periphery of the capacitive coupling element body, or the power supply layer pattern further includes the power supply layer wire and the capacitive coupling element further includes the capacitive coupling element wire,wherein the via is disposed at an end of the capacitive coupling element wire, andwherein the power supply layer pattern and the capacitive coupling element form an EBG structure in which the EBG unit cells are disposed at regular intervals, the EBG unit cells being disposed through the via connected to at least one of the power supply layer wire and the capacitive coupling element wire.2. The printed wiring board according to claim 1,wherein the power supply layer electrode and the capacitive coupling element body have an approximately rectangular shape and an approximately equal size,wherein the branch extends from one corner portion of the power supply layer electrode to near an adjacent corner portion, the branch and the power supply layer electrode being divided by forming a slit,wherein the capacitive coupling element wire extends from a corner portion of the capacitive coupling element body toward location where the branch extends, andwherein a leading end of the branch and a leading end of the capacitive coupling element wire are connected to each other at leading ends through a via.3. The printed wiring board according to claim 1,wherein the power supply layer electrode and the capacitive coupling element body have an approximately rectangular shape and an approximately equal size, the power supply layer wire has a length approximately equal to at least one side of a periphery of the power supply layer electrode, and the capacitive coupling element wire surrounds at least a half of a periphery of the capacitive coupling element body, andwherein a leading end of the power supply layer wire and a leading end of the capacitive coupling element wire are connected to each other at leading ends through a via.4. The printed wiring board according to claim 1, wherein a thickness of the interlayer between the power supply layer pattern and the capacitive coupling element is equal to or less than 25 μm.5. A printed wiring board comprising:a power supply layer, a via, and a ground layer,wherein a power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EGB) unit cells,wherein a capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer being provided between the capacitive coupling element and the power supply layer electrode,wherein the power supply layer pattern further includes a power supply layer wire that extends from the power supply layer electrode to surround at least a portion of a periphery of the power supply layer electrode, or the capacitive coupling element further includes a capacitive coupling element wire that extends from the capacitive coupling element body to surround at least a portion of a periphery of the capacitive coupling element body, or the power supply layer pattern further includes the power supply layer wire and the capacitive coupling element further includes the capacitive coupling element wire,wherein the power supply layer electrode and the capacitive coupling element body have an approximately rectangular shape and an approximately equal size,wherein the branch extends from one corner portion of the power supply layer electrode to near an adjacent corner portion, the branch and the power supply layer electrode being divided by forming a slit,wherein the capacitive coupling element wire extends from a corner portion of the capacitive coupling element body toward location where the branch extends,wherein a leading end of the branch and a leading end of the capacitive coupling element wire are connected to each other at leading ends through the via, andwherein the power supply layer pattern and the capacitive coupling element form an EBG structure in which the EBG unit cells are disposed at regular intervals, the EBG unit cells being disposed through the via connected to at least one of the power supply layer wire and the capacitive coupling element wire.6. A printed wiring board comprising:a power supply layer, a via, and a ground layer,wherein a power supply layer pattern formed in the power supply layer includes a power supply layer electrode and a branch that is a direct-current power feeding path connecting adjacent electromagnetic band gap (EGB) unit cells,wherein a capacitive coupling element including a capacitive coupling element body is disposed to oppose the power supply layer electrode with an interlayer being provided between the capacitive coupling element and the power supply layer electrode,wherein the power supply layer pattern further includes a power supply layer wire that extends from the power supply layer electrode to surround at least a portion of a periphery of the power supply layer electrode, or the capacitive coupling element further includes a capacitive coupling element wire that extends from the capacitive coupling element body to surround at least a portion of a periphery of the capacitive coupling element body, or the power supply layer pattern further includes the power supply layer wire and the capacitive coupling element further includes the capacitive coupling element wire,wherein the power supply layer electrode and the capacitive coupling element body have an approximately rectangular shape and an approximately equal size, the power supply layer wire has a length approximately equal to at least one side of a periphery of the power supply layer electrode, and the capacitive coupling element wire surrounds at least a half of a periphery of the capacitive coupling element body,wherein a leading end of the power supply layer wire and a leading end of the capacitive coupling element wire are connected to each other at leading ends through the via, andwherein the power supply layer pattern and the capacitive coupling element form an EBG structure in which the EBG unit cells are disposed at regular intervals, the EBG unit cells being disposed through the via connected to at least one of the power supply layer wire and the capacitive coupling element wire.
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