As described above with reference to FIGS. 8A to 9B, in the second modified embodiment, the conductor is excluded from the corner parts S1, S2 of the respective wiring substrates 21, 22, so that the characteristic of the chip antenna 24 is maintained. In this case, the more distant the conductor is from the chip antenna 24, the conductor less influences the chip antenna 24. Therefore, the more distant the first to fourth conductor formation regions R1 to R4 are from the chip antenna 24, it is possible to secure the wider regions.

In the second modified embodiment, a degree of design freedom of the electronic device 20 is increased by taking advantage of a degree of freedom of each of the conductor formation regions R1 to R4, as follows.

FIG. 15 is a projective plan view of the first wiring substrate 21 and the second wiring substrate 22 in accordance with the second modified embodiment.

Meanwhile, in FIG. 15, the same elements as FIGS. 4 to 14B are denoted with the same reference numerals FIGS. 4 to 14B, and the descriptions thereof are omitted.

As shown in FIG. 15, in the second modified embodiment, an area of the fourth dielectric region E4 of the uppermost layer is largest, and areas are reduced in order of a third dielectric region E3, a second dielectric region E2 and a first dielectric region E1. In the meantime, the dielectric regions E1 to E4 have a rectangular shape, respectively, and are similar to each other.