In the meantime, in the shown example, in order to prevent the radio wave, which is to be transmitted and received by the chip antenna 5, from being shielded by the ground pattern 7 and the electronic component 6, the protrusion 3a is provided outside the conductor formation region R, and only the conductor pattern 9 for transmitting and receiving a signal to and from the chip antenna 5 is provided to the protrusion 3a.

According to the electronic device 1 as described above, since the protrusion 3a of the second wiring substrate 3 is mounted thereon with the chip antenna 5, it is possible to suppress the radio wave, which is to be transmitted and received by the chip antenna 5, from being shielded by the ground pattern 7 and the electronic component 6, so that it is possible to favorably receive the radio wave by the chip antenna 5.

However, the protrusion 3a is provided, so that it is not possible to sufficiently reduce a planar size of the electronic device 1. Therefore, it is not possible to sufficiently use the merit of the POP, i.e., the downsizing of the electronic device 1.

In the below, each exemplary embodiment in which the electronic device can be downsized is described.

FIG. 4 is a side view of an electronic device in accordance with a first exemplary embodiment.