The invention claimed is:1. A thick conductor built-in type printed wiring board comprising:a printed wiring board that includes an insulating layer and a circuit provided on one main surface or both main surfaces of the insulating layer, the insulating layer including a cured product of a first resin composition, the circuit including a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive;an insulating resin layer that covers a surface of the printed wiring board on which the circuit is provided, the insulating resin layer including a cured product of a second resin composition and no fibrous base material;an insulating base material layer that covers the insulating resin layer, the insulating base material layer including a cured product of a third resin composition and a fibrous base material; anda conductor layer that covers the insulating base material layer,wherein:the insulating resin layer is disposed between the circuit and the insulating base material layer, anda void having a diameter of more than or equal to 10 μm is not included inside the thick conductor built-in type printed wiring board.2. The thick conductor built-in type printed wiring board according to claim 1, wherein a distance between the circuit and the conductor layer ranges from 20 μm to 1000 μm, inclusive.3. The thick conductor built-in type printed wiring board according to claim 1, wherein:the second resin composition has a minimum melt viscosity ranging from 1×102 Pa·s to 1×106 Pa·s, inclusive, the minimum melt viscosity being obtained at a first temperature ranging from 60° C. to 130° C., inclusive, andthe third resin composition has a minimum melt viscosity ranging from 1×102 Pa·s to 1×105 Pa·s, inclusive, the minimum melt viscosity being obtained at a second temperature of more than or equal to the first temperature at which the minimum melt viscosity of the second resin composition is obtained and less than or equal to 170° C.4. A method for producing a thick conductor built-in type printed wiring board, the method comprising:step (A) of preparing a printed wiring board that has an insulating layer and a circuit provided on one main surface or both main surfaces of the insulating layer, the insulating layer including a cured product of a first resin composition, the circuit including a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive;step (B) of forming a laminated body by overlapping a resin layer, a prepreg, and a conductor layer in this order on a surface of the printed wiring board on which the circuit is provided, the resin layer including an uncured product of a second resin composition and no fibrous base material, the prepreg including a fibrous base material and an uncured product of a third resin composition that is impregnated in the fibrous base material; andstep (C) of integrating the laminated body by heating and compressing the laminated body disposed between hot plates,wherein in the step (B), the resin layer is disposed between the circuit and the prepreg.5. The method for producing the thick conductor built-in type printed wiring board according to claim 4, wherein:the second resin composition has a minimum melt viscosity ranging from 1×102 Pa·s to 1×106 Pa·s, inclusive, the minimum melt viscosity being obtained at a first temperature ranging from 60° C. to 130° C., inclusive, andthe third resin composition has a minimum melt viscosity ranging from 1×102 Pa·s to 1×105 Pa·s, inclusive, the minimum melt viscosity being obtained at a second temperature of more than or equal to the first temperature at which the minimum melt viscosity of the second resin composition is obtained and less than or equal to 170° C.6. The method for producing the thick conductor built-in type printed wiring board according to claim 5, wherein in step (C), after the hot plates are heated with the laminated body disposed between the hot plates, compression of the laminated body is started when a temperature of the hot plates becomes within a range from a temperature lower than the second temperature by 20° C. to a temperature higher than the second temperature by 20° C., the minimum melt viscosity of the third resin composition being obtained at the second temperature.
