FIG. 2A is a schematic cross-sectional view of step (A) in a method for producing the thick conductor built-in type printed wiring board according to the exemplary embodiment. FIG. 2B is a schematic cross-sectional view of step (B) in the method for producing the thick conductor built-in type printed wiring board according to the exemplary embodiment. FIG. 2C is a schematic cross-sectional view of step (C) in the method for producing the thick conductor built-in type printed wiring board according to the exemplary embodiment. In FIG. 2A and FIG. 2B, the same reference marks are used for the same constituent elements as those illustrated in FIG. 1, and description thereof is omitted.
The method for producing the thick conductor built-in type printed wiring board according to the exemplary embodiment includes step (A), step (B), and step (C) to be described below. Step (A), step (B), and step (C) are performed in this order.
Step (A) is a step of preparing printed wiring board 10 illustrated in FIG. 2A.
