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Vertical exhaust duct for electronic equipment enclosure

專利號(hào)
US10791640B2
公開日期
2020-09-29
申請(qǐng)人
CHATSWORTH PRODUCTS, INC.（US CA Agoura Hills）
發(fā)明人
Richard Evans Lewis, II; Dennis W. Vanlith
IPC分類
H05K5/02; H05K7/20
技術(shù)領(lǐng)域
enclosure,duct,air,exhaust,enclosures,ducted,diverter,in,panels,panel
地域： CA CA Agoura Hills

摘要

An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

說明書

FIG. 12 is a side cross-sectional view of the ducted exhaust equipment enclosure of FIG. 11, taken along the line 12-12; and

FIG. 13 is a schematic illustration of a series of ducted exhaust equipment enclosures.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As a preliminary matter, it will readily be understood by one having ordinary skill in the relevant art (“Ordinary Artisan”) that the present invention has broad utility and application. Furthermore, any embodiment discussed and identified as being “preferred” is considered to be part of a best mode contemplated for carrying out the present invention. Other embodiments also may be discussed for additional illustrative purposes in providing a full and enabling disclosure of the present invention. Moreover, many embodiments, such as adaptations, variations, modifications, and equivalent arrangements, will be implicitly disclosed by the embodiments described herein and fall within the scope of the present invention.

權(quán)利要求

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