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Plated opening with vent path

專利號(hào)
US10834817B2
公開日期
2020-11-10
申請(qǐng)人
NXP USA, INC.（US TX Austin）
發(fā)明人
Michael B. Vincent; Zhiwei Gong; Scott M. Hayes
IPC分類
H05K13/04; H05K1/11; H05K3/42; H05K3/00; H05K3/28; H05K3/34; H05K1/18; H01L21/48; H01L23/498; H01L21/56; H01L23/31; H05K1/14
技術(shù)領(lǐng)域
workpiece,plated,vent,sidewall,opening,openings,plating,conductive,interposer,solder
地域： TX TX Austin

摘要

A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.

說明書

This application is a divisional application of a U.S. patent application entitled “PLATED OPENING WITH VENT PATH”, having a serial number of Ser. No. 15/380,054, having a filing date of Dec. 15, 2016, having common inventors, and having a common assignee, all of which is incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION Field of the Invention

This invention relates in general plated openings for electronic component assemblies and more specifically to a plated opening with a vent path in an electronic component assembly.

Description of the Related Art

Electronic components and electronic component packages can be coupled to devices such as interposers, substrates, and circuit boards. Electrical coupling can be made by the use of plated openings in the interposer, substrate or circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerous objects, features, and advantages made apparent to those skilled in the art by referencing the accompanying drawings.

FIG. 1 is a partial cutaway side view of an electronic component assembly according to one embodiment of the present invention

FIG. 2 is a flow chart showing a method for forming a plated opening in a workpiece according to one embodiment of the present invention.

FIGS. 3A-3C show prospective views of a workpiece in three different stages in forming a plated opening according to one embodiment of the present invention.

權(quán)利要求

1
What is claimed is:1. An electronic component assembly comprising:an electronic component;a workpiece including an opening extending from a first major surface of the workpiece, the opening including an opening sidewall of non-conductive material;a sidewall plating, the sidewall plating covers a first portion of the opening sidewall of the non-conductive material in a plane parallel to the first major surface, a second portion of the opening sidewall in the plane is not covered by the sidewall plating;a conductive structure electrically coupled to the sidewall plating with a conductive joint material structure attached to the sidewall plating and to the conductive structure, wherein at least a portion of the conductive joint material structure is located in the opening and attached to the sidewall plating in the opening including in the plane, wherein the conductive joint material structure is not attached to the second portion of the opening sidewall in the plane.2. The assembly of claim 1 wherein the sidewall plating extends to a conductive structure embedded in the workpiece and the sidewall plating and a portion of the opening are characterized as a plated blind via.3. The assembly of claim 2 wherein a second sidewall plating covers a third portion of the opening sidewall in the plane, the assembly further includes a second conductive structure electrically coupled to the second sidewall plating with a second conductive joint material structure attached to the second sidewall plating and to the second conductive structure, wherein at least a portion of the second conductive joint material structure is located in the opening and attached to the second sidewall plating in the opening, wherein the second conductive joint material structure is not attached to the second portion of the opening sidewall in the plane and is not attached to the sidewall plating.4. The assembly of claim 1 wherein the sidewall plating and the opening extends to a second major surface of the workpiece opposite the first major surface and a portion of the opening and the sidewall plating are characterized as a plated through hole via.5. The assembly of claim 4 wherein a second sidewall plating covers a third portion of the opening sidewall in the plane, the assembly further includes a second conductive structure electrically coupled to the second sidewall plating with a second conductive joint material structure attached to the second sidewall plating and to the second conductive structure, wherein at least a portion of the second conductive joint material structure is located in the opening and attached to the second sidewall plating in the opening, wherein the second conductive joint material structure is not attached to the second portion of the opening sidewall in the plane and is not attached to the sidewall plating.6. The assembly of claim 1 wherein the workpiece is characterized as an interposer and the conductive structure is a conductive structure of a substrate, wherein the interposer is encapsulated in an encapsulant with the electronic component.7. The assembly of claim 1 wherein the second portion of the opening sidewall in the plane is covered by an encapsulant.8. The assembly of claim 1 wherein a second sidewall plating covers a third portion of the opening sidewall in the plane, the assembly further includes a second conductive structure electrically coupled to the second sidewall plating with a second conductive joint material structure attached to the second sidewall plating and to the second conductive structure, wherein at least a portion of the second conductive joint material structure is located in the opening and attached to the second sidewall plating in the opening, wherein the second conductive joint material structure is not attached to the second portion of the opening sidewall in the plane and is not attached to the sidewall plating.9. The assembly of claim 1 wherein a second sidewall plating covers a third portion of the opening sidewall in the plane, the assembly further includes a second conductive structure electrically coupled to the second sidewall plating with a second conductive joint material structure attached to the second sidewall plating and to the second conductive structure, wherein at least a portion of the second conductive joint material structure is located in the opening and attached to the second sidewall plating in the opening, wherein the second conductive joint material structure is not attached to the second portion of the opening sidewall in the plane and is not attached to the sidewall plating.
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