FIGS. 8A and 8B are a top and side cross sectional views, respectively, of workpiece 801 according to another embodiment of the present invention. Workpiece 801 includes plated openings (803 and 805) with sidewall platings (807 and 809). The plated openings include vent holes 811 and 813 that extend out the lateral side of workpiece 801. FIG. 8C is a cross sectional side view of assembly 800 that includes workpiece 801 and substrates 831 and 833. Substrate 831 includes conductive pads 817 and 815 that are coupled with solder joints 819 and 821 to sidewall plating 807 and 809, respectively. Substrate 833 also includes pads (825) that are electrically coupled to sidewall platings (807) of workpiece 801 with joints (829).

In one embodiment, workpiece 801 was originally part of a larger workpiece that included multiples holes for each subsequently singulated workpiece (like workpiece 801). The vent hole slots (e.g. 811) were made to connect an opening 803 of workpiece 801 with an opening of an adjacent workpiece (not shown) prior to singulation. In another embodiment, vent holes 811 are formed from drilling from the lateral side of workpiece 801.

FIG. 9 is a top view of another workpiece 901 that includes one vent hole (907) for each plated opening (903). In the embodiment of FIG. 9, the vent holes are positioned diagonally with respect to the lateral sides of the workpiece. One advantage to positioning the vent holes diagonally is that plated openings can be positioned closer together.